Method for fabricating a hybrid orientation substrate

ABSTRACT

A method for fabricating a hybrid orientation substrate includes steps of providing a direct silicon bonding (DSB) wafer having a first substrate with (100) crystalline orientation and a second substrate with (110) crystalline orientation directly bonded on the first substrate, forming and patterning a first blocking layer on the second substrate to define a first region not covered by the first blocking layer and a second region covered by the first blocking layer, performing an amorphization process to transform the first region of the second substrate into an amorphized region, and performing an annealing process to recrystallize the amorphized region into the orientation of the first substrate and to make the second region stressed by the first blocking layer.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method for fabricating a hybridorientation substrate, and more particularly, to a method forfabricating a hybrid orientation substrate with solid phase epitaxy(SPE) technique.

2. Description of the Prior Art

Semiconductor device technology is increasingly relying on specialtySi-based substrates to improve the performance of complementary metaloxide semiconductor (CMOS) devices. For example, to fully take advantageof the silicon orientation dependence of carrier mobility, NMOS and PMOStransistors are respectively fabricated on (100)-Si substrate in whichelectron mobility is higher and on (110)-Si substrate in which holemobility is higher. Such strong dependence of carrier mobility onsilicon orientation has led to increased interest in the hybridorientation substrate.

In prior art, the hybrid orientation substrate was achieved on directsilicon bonding (DSB) mixed orientation substrates using solid phaseepitaxy (SPE). Please refer to FIGS. 1-5, which are schematic drawingsillustrating a conventional method for fabricating a hybrid orientationsubstrate. As shown in FIG. 1, a (100)-oriented Si substrate 100 isprovided and a (110)-oriented Si substrate 102 is directly bonded to the(100)-oriented Si substrate 100 by DSB technique without interfacialoxide formed in between. And a photoresist 104 is formed on the(110)-oriented Si substrate 102 to define an NMOS region 110 and a PMOSregion 112.

Please refer to FIGS. 2-4. Then, a SPE method is used to convert theorientation of NMOS region 110 from (110)-oriented into (100)-oriented.As shown in FIG. 2, the NMOS region 110 is exposed to an amorphizing ionimplantation 120 and is amorphized to a depth beyond the bondedinterface between the (100)-oriented Si substrate 100 and the(110)-oriented Si substrate 102, thus an amorphized region 122 isformed.

Please refer to FIGS. 3 and 4. The amorphized region 122 is thenrecrystallized into the bottom crystal orientation. By using the(100)-oriented Si substrate 100 as a template, a (100)-orientedepitaxial region 124 is formed, and thus a hybrid orientation Sisubstrate is obtained. The interface region 130 between the(100)-oriented epitaxial region 124 and the (110)-oriented Si substrateis removed to form a shallow trench isolation (STI) 140 for providing anelectrical isolation between the NMOS region 110 and the PMOS region 112as shown in FIG. 5.

Please refer to FIG. 3 again. It is noteworthy that the (100)-orientedepitaxial region 124 is recrystallized along both surfaces of the(100)-oriented Si substrate 100 and the (110)-oriented Si substrate 102,respectively with the (100) and (110) crystalline orientations as thearrows shown in FIG. 3. Therefore the interface region 130 between the(100)-oriented epitaxial region 124 and the (110)-oriented Si substrate102 is slanted as shown in FIG. 4. It is easily realized that the moreslanted interface causes the bigger interface region 130. Since theslanted interface region 130 is entirely removed to form the STI 140,the bigger interface region 130 results the bigger STI 140 whichconsumes valuable space on a semiconductor wafer and reduces theintegration of the semiconductor wafer.

SUMMARY OF THE INVENTION

Therefore the present invention provides a method for fabricating ahybrid orientation substrate capable of reducing lateral morphologyextension in the hybrid orientation substrate.

According to the claimed invention, a method for fabricating a hybridorientation substrate is provided. The method comprises steps ofproviding a direct silicon bonding (DSB) wafer having a first substratewith (100) crystalline orientation and a second substrate with (110)crystalline orientation formed on the first substrate, forming andpatterning a first blocking layer on the second substrate to define afirst region not covered by the first blocking layer and a second regioncovered by the first blocking layer, performing an amorphization processto transform the first region of the second substrate into an amorphizedregion, and performing an annealing process to recrystallize theamorphized region into the orientation of the first substrate and tomake the second region stressed by the first blocking layer.

According to the claimed invention, another method for fabricating ahybrid orientation substrate is provided. The method comprises providinga direct silicon bonding (DSB) wafer having a first substrate with (100)crystalline orientation and a second substrate with (110) crystallineorientation formed thereon, forming and patterning a first blockinglayer on the second substrate to define a first region not covered bythe first blocking layer and a second region covered by the firstblocking layer, performing an amorphization process to transform thefirst region and the second region respectively into a first amorphizedregion and a second amorphized region, and performing an annealingprocess to recrystallize the first amorphized region and the secondamorphized region respectively into the orientations of the firstsubstrate and the second substrate.

According to the claimed invention, another method for fabricating ahybrid orientation substrate is provided. The method comprises providinga direct silicon bonding (DSB) wafer having a first substrate with (100)crystalline orientation and a second substrate with (110) crystallineorientation formed thereon, performing a first amorphization process topartially transform the second substrate into a first amorphized region,forming a patterned first blocking layer on the second substrate todefine a first region not covered by the first blocking layer and asecond region covered by the first blocking layer, performing a secondamorphization process to transform the first region into an secondamorphized region, and performing an annealing process to recrystallizethe first amorphized region into the orientation of the second substrateand the second amorphized region into the orientation of the firstsubstrate.

According to the claimed invention, still another method for fabricatinga hybrid orientation substrate is provided. The method comprisesproviding a direct silicon bonding (DSB) wafer having a first substratewith a first crystalline orientation and a second substrate with asecond crystalline orientation formed thereon, forming and patterning ablocking layer on the second substrate to define a first region notcovered by the blocking layer and a second region covered by theblocking layer, performing an ion implantation process to implant adopant into the first region of the second wafer to form an amorphizedregion, and performing an annealing process to recrystallize theamorphized region into the orientation of the first substrate.

Accordingly, the lateral morphology extension in the hybrid orientationsubstrate is reduced so that the interface region between the firstsubstrate and the second substrate is correspondingly reduced and thusspace for forming the STI is economized. Furthermore, a provided stresslayer in the present invention further improves a speed of the MOStransistors and recrystallization quality.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-5 are schematic drawings illustrating a conventional method forfabricating a hybrid orientation substrate.

FIGS. 6-10 are schematic drawings illustrating a first preferredembodiment of the method for fabricating a hybrid orientation substrate.

FIGS. 11-16 are schematic drawings illustrating a second preferredembodiment of the method for fabricating a hybrid orientation substrate.

FIGS. 17-21 are schematic drawings illustrating a third preferredembodiment of the method for fabricating a hybrid orientation substrate.

DETAILED DESCRIPTION

Please refer to FIGS. 6-10, which are schematic drawings illustrating afirst preferred embodiment of the method for fabricating a hybridorientation substrate. As shown in FIG. 6, a direct silicon bonding(DSB) wafer 200 having a first substrate 202 with a first crystallineorientation and a second substrate 204 with a second crystallineorientation directly bonded on the first substrate 202 is firstlyprovided. In the first preferred embodiment, the first crystallineorientation is (100) and the second crystalline orientation is (110).However, it is not limited that the first crystalline orientation can be(110) or other crystalline orientations while the second crystallineorientation is (100) or other crystalline orientations. Then, a firstblocking layer 210 comprising silicon oxide, silicon nitride, or siliconoxynitride is formed on the second substrate 204. The first blockinglayer 210 is patterned to define a first region 212 not covered by thefirst blocking layer 210 and a second region 214 covered by the firstblocking layer 210.

Please refer to FIG. 7. Next, an amorphization process is performed totransform the first region 212 of the second substrate 204 into anamorphized region 220. The amorphization process is performed byimplanting dopants comprising Si, Ge, Ar, C, O, N, H, He, Kr, Xe, P, B,As, or a mixture thereof into the first region 212 with the firstblocking layer 210 used as an implant mask. Please note that the dopantsare implanted to a depth beyond a bonded interface of the firstsubstrate 202 and the second substrate 204.

Please refer to FIG. 8. Then, an annealing process is performed torecrystallize the amorphized region 220 into the orientation of thefirst substrate 202. It is noteworthy the second region 214 is stressedby a compressive stress provided by the first blocking layer 210 in theannealing process. The second region 214 is an active region used toconstruct a PMOS transistor while the recrystallized first region 212having the crystalline orientation of the first substrate 202 is anactive region on which an NMOS transistor is constructed. Therefore thecompressive stress provided by the first blocking layer 210 to thesecond region 210 further improves a performance of the PMOS transistor.

Please refer to FIG. 9. In addition, a second blocking layer or astress-adjusting layer 230 is formed on the first region 212 and thefirst blocking layer 210 before performing the annealing process. Thesecond blocking layer 230 can be patterned to expose the first blockinglayer 210 as shown in FIG. 10. The second blocking layer 230 provides atensile stress to the first region 212 and therefore the first region212 is stressed in the annealing process. As mentioned above, thetensile stress provided by the second blocking layer 230 improves aperformance of the NMOS transistor formed on the first region 212afterwards. Furthermore, lattice of the amorphized region 230 isadjusted by the second blocking layer 230 so that the recrystallizationquality in the amorphized region 230 is effectively improved.

According to the provided first preferred embodiment, the hybridorientation substrate is fabricated with tensile/compressive stressprovided by the blocking layers. Therefore the electron mobility of NMOStransistor and the hole mobility of the PMOS transistor are not onlyimproved by being respectively constructed on advantageous crystallineorientations in a wafer while the recrystallization quality of therecrystallized crystalline itself is also improved by the stress, butalso improved by the stress provided by the stressed blocking layers asstrained-silicon transistors.

Please refer to FIGS. 11-16, which are schematic drawings illustrating asecond preferred embodiment of the method for fabricating a hybridorientation substrate. As shown in FIG. 11, a DSB wafer 300 having afirst substrate 302 with a first crystalline orientation and a secondsubstrate 304 with a second crystalline orientation directly bonded onthe first substrate 302 is firstly provided. In the second preferredembodiment, the first crystalline orientation is (100) and the secondcrystalline orientation is (110). However, it is not limited that thefirst crystalline orientation can be (110) or other crystallineorientations while the second crystalline orientation is (100) or othercrystalline orientations. Then, a first blocking layer 310 comprisingsilicon oxide, silicon nitride, or silicon oxynitride is formed on thesecond substrate 304. The first blocking layer 310 is patterned todefine a first region 312 not covered by the first blocking layer 310and a second region 314 covered by the first blocking layer 310.

Please refer to FIG. 12, then, an amorphization process is performed byimplanting dopants into the first region 312 and the second region 314with the first blocking layer 310 used as an implant mask. The dopantscomprise Si, Ge, Ar, C, O, N, H, He, Kr, Xe, P, B, As, or a mixturethereof. The amorphization process is used to transform the first region312 and the second region 314 respectively into a first amorphizedregion 322 and a second amorphized region 324. It is noteworthy that byadjusting factors such as a thickness of the first blocking layer 310 oran implantation energy, the dopants in the first amorphized region 322are implanted into a depth beyond a bonded interface of the firstsubstrate 302 and the second substrate 304 while the dopants in thesecond amorphized region 324 are implanted through the first blockinglayer 310 into a depth no more than a thickness of the second substrate304.

Please refer to FIGS. 13 and 14. Next, an annealing process is performedto recrystallize the first amorphized region 322 and the secondamorphized region 324 respectively into the orientations of the firstsubstrate 302 and the second substrate 304. It is noteworthy that theepitaxial silicon in the first amorphized region 322 and the secondamorphized region 324 are recrystallized respectively along withsurfaces of the first substrate 302 and the second substrate 304 andalong with the crystalline orientation of the first substrate 302 andthe second substrate 304 as the arrows shown in FIG. 13.

Please refer to FIG. 14. Therefore an interface region 330 between therecrystallized first region 312 and the recrystallized second region 314is formed as a right trapezoid. Such geometric character makes theinterface region 330 between the recrystallized first region 312 and therecrystallized second region 314 smaller and thus a shallow trenchisolation formed to replace the interface region 330 can be smaller.

In addition, the second region 314 is stressed by the first blockinglayer 310 in the annealing process. Thus a compressive stress isprovided to the second region 314 which is an active region used toconstruct a PMOS transistor afterwards. Furthermore, lattice of thesecond amorphized region 324 is adjusted by the first blocking layer 310so that the recrystallization quality in the second amorphized region324 is effectively improved. Moreover, a second blocking layer or astress-adjusting layer 340 is formed on the first region 312 and thefirst blocking layer 310 before performing the annealing process asshown in FIG. 15. In addition, the second blocking layer 340 can bepatterned to expose the first blocking layer 310 as shown in FIG. 16.Thus the first region 312, which is an active region used to constructan NMOS transistor afterwards, is stressed by a tensile stress from thesecond blocking layer 340 in the annealing process. As mentioned above,the compressive stress provided by the first blocking layer 310 to thesecond region 320 further improves a performance of the PMOS transistorand the tensile stress provided by the second blocking layer 345improves a performance of the NMOS transistor. Lattice of the firstamorphized region 322 is adjusted by the second blocking layer 340 sothat the recrystallization quality of the first amorphized region 322 isalso effectively improved by the second blocking layer 330.

According to the second preferred embodiment provided by the presentinvention, the interface region 330 of the hybrid orientation substratehas a shape of right trapezoid and is smaller, therefore the STI formedto replace the interface region 330 is correspondingly smaller. Inaddition, the hybrid orientation substrate is fabricated with stressedblocking layers. Therefore the electron mobility of NMOS transistor andthe hole mobility of the PMOS transistor are not only improved by beingrespectively constructed on advantageous crystalline orientations in awafer with smaller STI while the recrystallization quality of therecrystallized crystalline itself is also improved by the stress, butalso improved by the stress provided by the stressed blocking layers asstrained-silicon transistors.

Please refer to FIGS. 17-21, which are schematic drawings illustrating athird preferred embodiment of the method for fabricating a hybridorientation substrate. As shown in FIG. 17, a DSB wafer 400 having afirst substrate 402 with a first crystalline orientation and a secondsubstrate 404 with a second crystalline orientation formed on the firstsubstrate 402 is firstly provided. In the third preferred embodiment,the first crystalline orientation is (100) and the second crystallineorientation is (110). However, it is not limited that the firstcrystalline orientation can be (110) or other crystalline orientationswhile the second crystalline orientation is (100) or other crystallineorientations.

Please still refer to FIG. 17. Next, a first amorphization process isperformed by implanting dopants into the second substrate 404 andpartially transforming the second substrate 404 into a first amorphizedregion 410. Please note the dopants in the first amorphization processare implanted into a depth no more than a thickness of the secondsubstrate 404. The dopants comprise Si, Ge, Ar, C, O, N, H, He, Kr, Xe,P, B, As, or a mixture thereof.

Please refer to FIG. 18. Then, a patterned first blocking layer 420 isformed on the second substrate 404. The patterned first blocking layer420 defines a first region 432 not covered by the first blocking layer420 and a second region 434 covered by the first blocking layer 420.Next, a second amorphization process is performed to transform a part ofthe first amorphized region 410 in the first region 432 into an secondamorphized region 440. The second amorphization is performed byimplanting the dopants into the first region 432 with the patternedfirst blocking layer 434 used as an implant mask. It is noteworthy thatthe dopants in the second amorphization process are implanted into adepth beyond a bonded interface of the first substrate 402 and thesecond substrate 404.

Please refer to FIG. 19. An annealing process is performed torecrystallize the first amorphized region 410 into the orientation ofthe second substrate 404 and the second amorphized region 440 into theorientation of the first second substrate 402. Please note that, asmentioned before, the epitaxial silicon in the first amorphized region410 and the second amorphized region 440 are recrystallized respectivelyalong with surfaces of the second substrate 404 and the first substrate402, and along with the crystalline orientation of the second substrate404 and the first substrate 402. Therefore an interface region 450between the recrystallized first region 432 and the recrystallizedsecond region 434 is formed as a right trapezoid. Such geometriccharacter makes the interface region 450 between the recrystallizedfirst region 432 and the recrystallized second region 434 smaller andthus a shallow trench isolation formed to replace the interface region450 can be smaller.

In addition, the first blocking layer 420 comprises silicon oxide,silicon nitride, or silicon oxynitride or photoresist. On the one handthe first blocking layer 420 made of photoresist will be removed beforeperforming the annealing, and on the other the first blocking layer 420made of silicon oxide, silicon nitride, or silicon oxynitride will beremained on the DSB wafer 400 during the annealing process. The secondregion 434 is stressed by a compressive stress from the remained firstblocking layer 420 in the annealing process. Furthermore, lattice of thefirst amorphized region 410 is adjusted by the first blocking layer 420so that the recrystallization quality in the first amorphized region 410is effectively improved.

Please refer to FIG. 20. Furthermore, a second blocking layer or astress-adjusting layer 460 is formed on the first region 432 and thefirst blocking layer 420 before performing the annealing process. Inaddition, the second blocking layer 460 can be patterned to expose thefirst blocking layer 420 as shown in FIG. 21. The first region 432,which is an active region used to construct an NMOS transistorafterwards, is stressed by a tensile stress from the second blockinglayer 460 in the annealing process. As mentioned above, the compressivestress provided by the first blocking layer 420 to the second region 434further improves a performance of the PMOS transistor and the tensilestress provided by the second blocking layer 460 improves a performanceof the NMOS transistor. Lattice of the second amorphized region 440 isadjusted by the second blocking layer 460 so that the recrystallizationquality in the second amorphized region 440 is also effectivelyimproved.

According to the third preferred embodiment provided by the presentinvention, the interface region 450 of the hybrid orientation substratehas a shape of right trapezoid and is smaller, therefore the STI formedto replace the interface region 450 is correspondingly smaller. Inaddition, the hybrid orientation substrate is fabricated with blockinglayers. Therefore the electron mobility of NMOS transistor and the holemobility of the PMOS transistor are not only improved by beingrespectively constructed on advantageous crystalline orientations in awafer with smaller STI while the recrystallization quality of therecrystallized crystalline itself is also improved by the stress, butalso improved by the stress provided by the stressed blocking layers asstrained-silicon transistors.

As mentioned above, although the DSB wafers in the first, second, andthird preferred embodiment have a first substrate with a (100)crystalline orientation and a second substrate with a (110) crystallineorientation formed on the first substrate, it is not limited that theDSB wafer must have a first substrate with (110) crystalline orientationand a second substrate with (100) crystalline orientation. In theexemplary FIG. 8, the recrystallized first region 212 is recrystallizedalong the (110) crystalline orientation of the first substrate 202 to bean active region used to form a PMOS transistor while the second region214 is recrystallized along the (100) crystalline orientation of thesecond substrate 204 to be an active region used to form an NMOStransistor. Therefore the first blocking layer 210 provides a tensilestress to the second region 214 in the annealing process and the secondblocking layer 230 provides a compressive stress to the first region212. The same concept can be applied to the second and the thirdpreferred embodiment. Therefore further description of the process isomitted in the interest of brevity in the second and the thirdembodiments.

Accordingly, the lateral morphology extension in the hybrid orientationsubstrate is reduced so that the slanted interface region between thefirst substrate and the second substrate is correspondingly reduced andthus space for forming the STI is economized. Furthermore, the stressedblocking layer in the present invention further improves a speed of theMOS transistors and recrystallization quality.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

1. A method for fabricating a hybrid orientation substrate comprisingsteps of: providing a direct silicon bonding (DSB) wafer having a firstsubstrate with a first crystalline orientation and a second substratewith a second crystalline orientation directly bonded thereon; formingand patterning a first blocking layer on the second substrate to definea first region not covered by the first blocking layer and a secondregion covered by the first blocking layer; performing an amorphizationprocess to transform the first region of the second substrate into anamorphized region; and performing an annealing process to recrystallizethe amorphized region into the orientation of the first substrate andsimultaneously to make the second region stressed by the first blockinglayer.
 2. The method of claim 1, wherein the first blocking layercomprises silicon oxide, silicon nitride, or silicon oxynitride.
 3. Themethod of claim 1, wherein the amorphization process is performed byimplanting dopants into the first region with the first blocking layerused as an implant mask.
 4. The method of claim 3, wherein the dopantscomprise Si, Ge, Ar, C, O, N, H, He, Kr, Xe, P, B, As, or a mixturethereof.
 5. The method of claim 3, wherein the dopants are implanted toa depth beyond a bonded interface of the first substrate and the secondsubstrate.
 6. The method of claim 1 further comprising a step of forminga second blocking layer on the first region and the first blocking layerbefore performing the annealing process.
 7. The method of claim 6,wherein the second blocking layer is patterned to expose the firstblocking layer.
 8. The method of claim 6, wherein the first region isstressed by the second blocking layer.
 9. The method of claim 1, whereinthe first crystalline orientation is (100) crystalline orientation andthe second crystalline orientation is (110) crystalline orientation. 10.The method of claim 1, wherein the first crystalline orientation is(110) crystalline orientation and the second crystalline orientation is(100) crystalline orientation.
 11. A method for fabricating a hybridorientation substrate comprising steps of: providing a direct siliconbonding (DSB) wafer having a first substrate with a first crystallineorientation and a second substrate with a second crystalline orientationdirectly bonded thereon; forming and patterning a first blocking layeron the second substrate to define a first region not covered by thefirst blocking layer and a second region covered by the first blockinglayer; performing an amorphization process to transform the first regionand the second region respectively into a first amorphized region and asecond amorphized region; and performing an annealing process torecrystallize the first amorphized region and the second amorphizedregion respectively into the orientations of the first substrate and thesecond substrate.
 12. The method of claim 11, wherein the amorphizationprocess is performed by implanting dopants into the first region and thesecond region with the first blocking layer used as an implant mask. 13.The method of claim 12, wherein the dopants comprise Si, Ge, Ar, C, O,N, H, He, Kr, Xe, P, B, As, or a mixture thereof.
 14. The method ofclaim 12, wherein the dopants in the first amorphized region areimplanted into a depth beyond a bonded interface of the first substrateand the second substrate.
 15. The method of claim 12, wherein thedopants in the second amorphized region are implanted through the firstblocking layer into a depth no more than a thickness of the secondsubstrate.
 16. The method of claim 11, wherein the first blocking layercomprises silicon oxide, silicon nitride, or silicon oxynitride.
 17. Themethod of claim 16, wherein the second region is stressed by the firstblocking layer.
 18. The method of claim 11 further comprising a step offorming a second blocking layer on the first blocking layer and thefirst region before performing the annealing process.
 19. The method ofclaim 18, wherein the second blocking layer is patterned to expose thefirst blocking layer.
 20. The method of claim 18, wherein the firstregion is stressed by the second blocking layer in the annealingprocess.
 21. The method of claim 11, wherein the first crystallineorientation is (100) crystalline orientation and the second crystallineorientation is (110) crystalline orientation.
 22. The method of claim11, wherein the first crystalline orientation is (110) crystallineorientation and the second crystalline orientation is (100) crystallineorientation.
 23. A method for fabricating a hybrid orientation substratecomprising steps of: providing a direct silicon bonding (DSB) waferhaving a first substrate with a first crystalline orientation and asecond substrate with a second crystalline orientation directly bondedthereon; performing a first amorphization process to partially transformthe second substrate into a first amorphized region; forming andpatterning a first blocking layer on the second substrate to define afirst region not covered by the first blocking layer and a second regioncovered by the first blocking layer; performing a second amorphizationprocess to transform the first region into an second amorphized region;and performing an annealing process to recrystallize the firstamorphized region into the orientation of the second substrate and thesecond amorphized region into the orientation of the first substrate.24. The method for claim 23, wherein the first amorphization process isperformed by implanting dopants into the second substrate, and thesecond amorphization process is performed by implanting the dopants intothe first region with the patterned first blocking layer used as animplant mask.
 25. The method of claim 24, wherein the dopants compriseSi, Ge, Ar, C, O, N, H, He, Kr, Xe, P, B, As, or a mixture thereof. 26.The method of claim 24, wherein the dopants in the first amorphizationprocess are implanted into a depth no more than a thickness of thesecond substrate.
 27. The method of claim 26, wherein the dopants in thesecond amorphization process are implanted into a depth beyond a bondedinterface of the first substrate and the second substrate.
 28. Themethod of claim 23, wherein the first blocking layer comprises aphotoresist.
 29. The method of claim 28, wherein the first blockinglayer is removed before performing the annealing process.
 30. The methodof claim 23, wherein the first blocking layer comprises silicon oxide,silicon nitride, or silicon oxynitride.
 31. The method of claim 30,wherein the second region is stressed by the first blocking layer in theannealing process.
 32. The method of claim 23 further comprising a stepof forming a second blocking layer on the first blocking layer and thefirst region before performing the annealing process.
 33. The method ofclaim 32, wherein the second blocking layer is patterned to expose thefirst blocking layer.
 34. The method of claim 32, wherein the firstregion is stressed by the second blocking layer in the annealingprocess.
 35. The method of claim 23, wherein the first crystallineorientation is (100) crystalline orientation and the second crystallineorientation is (110) crystalline orientation.
 36. The method of claim23, wherein the first crystalline orientation is (110) crystallineorientation and the second crystalline orientation is (100) crystallineorientation.